High Power Solid-State Lighting NTC Thermal Gold Electrodes Chip/ Silver Electrode Wafer Packaging Requirements

Compared with the traditional lighting, NTC thermal gold electrodes chip  / silver electrode chip lamps need not use filter or filter to produce have colored light, not only high efficiency light color, pure, and can realize the dynamic or gradual change color changes. In the change of the color temperature and maintain high show color index, meet different applications. But the packaging has also put forward new requirements, specific reflects in:

(2) system to maximize efficiency
In order to improve the NTC thermal gold electrodes chip/silver electrode chips out of lamps light efficiency, in addition to needs the right NTC thermal gold electrodes chip/silver electrode chip power outside, still must adopt effective heat dissipation structure and process, and optimizing internal/external optical design, in order to improve the efficiency of the system.

(3) low cost
NTC thermal gold electrodes chip/silver electrode chip lamps to to the market and must have cost competitive advantage (mainly refers to the initial installation costs), and sealed in the whole NTC thermal gold electrodes chip/silver electrode chip production cost of the lamps, a large part, therefore, the new package structure and technology to improve photosynthetic efficiency/cost ratio, is to realize NTC thermal gold electrodes chip/silver electrode chip lamps of commercialization of key.

(4) easy to replace and maintain
Because NTC thermal gold electrodes  / silver electrode chips light source long life and maintenance costs low, so the NTC thermal gold electrodes chip/silver electrode chip the encapsulation of the lamps set the high reliability requirements. Request NTC thermal gold electrodes chip/silver electrode chip design easy to improve the lamps and lanterns to meet the future higher efficiency of the thermal NTC gold electrodes chip/silver electrode chip chip packing requirements, and requires NTC thermal gold electrodes chip/silver electrode chip chips better replacement, in order to choose the type of lamps manufacturers chip.

NTC thermal gold electrodes chip/silver electrode chip lamp light source can be multiple distributed point light source composition, because the chip of small size, so that the packaging the lamps and lanterns of light weight, structure compact, and can meet all kinds of shapes and integration of the different needs. The only disappointment is that no ready-made design standards, but at the same time to the design provides sufficient imaginary space. In addition, NTC thermal gold electrodes chip/silver electrode chip lighting control first target is the power supply. General utility power is due to high voltage AC (220 V AC), and thermal NTC gold electrodes chip/silver electrode chip need constant current or limit the power flow, so must use conversion circuit or embedded control circuit (), in order to realize the advanced calibration and closed-loop feedback control system. In addition, through the digital lighting control technology for the use of solid state lighting and control relies mainly on the intelligent control and management software to realize, and thus to the user, information and a new connection between light source, and can give full play to the imagination of the designers and consumers.

Concluding remarks

NTC thermistor gold electrode chip / silver electrode chip package is related to a multidisciplinary (such as optical, thermal, mechanical, electrical, mechanical, material, semiconductor, etc.) research topic. From a certain perspective, NTC thermistor gold electrode chip/silver electrode chip package is not only a door manufacturing Technology (Technology), and is also a kind of basic Science (Science), good packaging need to heat, light, material and process mechanics, and other physical essence understanding and application. NTC thermistor gold electrode chip/silver electrode chip packaging design should be and chip design simultaneously, and need to light, heat, electricity, structure performance unification consideration. In the packaging process, although materials (cooling base plate, phosphor, potting glue) option is very important, but encapsulation structure (such as thermal interface, optical interface) on the NTC thermistor gold electrode chip/silver electrode chip efficacy and reliability has a very big impact, high power white NTC thermistor gold electrode chip/silver electrode chip package must use new materials, new technology, and new ideas. For the NTC thermistor gold electrode chip/silver electrode chip in terms of lamps and lanterns, but also need to light, heat, power supply and lamps and lanterns integrated consideration.