Packaging Production Technology of Gold Electrode NTC Chip Thermistor

Wafer bonding  technology is to point to the structure and the production, packaging are circuit in chips (Wafer), encapsulation complete to cut, form a single Chip.

With the corresponding chip bonding (Die bonding) is to point to the structure and circuit in the chip, after the completion of the cutting form chip (Die), then on to a single chip encapsulate (similar to now NTC thermal gold electrodes chip/silver electrode wafer packaging process), as shown in figure 6 shows. Obviously, wafer bonding encapsulation efficiency and quality of higher. Because the cost at encapsulation NTC thermal gold electrodes chip/silver electrode chip manufacturing cost of the device a high proportion, therefore, alter the existing NTC thermal gold electrodes chip/silver electrode wafer packaging form (from the chips bonding to the wafer bonding), will be lower packaging production cost. In addition, wafer bonding packaging can also improve thermal NTC gold electrodes chip/silver electrode chip component production of cleanliness, prevent the bonding of wafer process before, structural damage to the device, improve the packaging yield and reliability, it is a kind of effective method of reducing the cost of packaging.

In addition, for high-power NTC thermal gold electrodes chip/silver electrode wafer Packaging, must be in chip design and Packaging design process, use as far as possible process less Packaging form (Package-less Packaging), at the same time, simplify the encapsulation structure so as to reduce heat and optical interface number, in order to reduce encapsulation thermal resistance and improve the efficiency of the light.